Services
Wafer Reclaim Service
Our sophisticated process for reclaiming silicon wafers enables WRS Materials customers to reduce their materials cost by maximizing the full life potential of wafers. A highly experienced production staff is skilled in processes that generate the highest possible reclamation yield.
WRS Materials personnel begin the reclaim procedure with a refined wafer inspection to presort wafers by type, thickness and resistivity. Each wafer then is lapped and/or etched to remove patterns, scratches and other defects. The result is a clean, high-quality wafer that is ready for polishing and cleaning. To assist customers in tracking the lifecycle of their wafers, we also offer a laser marking service. At the conclusion of the reclaim process, to verify that the finished wafers fully comply with customer standards and specifications, we perform a final quality inspection prior to packaging.
We transfer the reclaimed wafers into cassettes that are free of contaminants. The cassettes are double-bagged and labeled. As a final step, we provide a Certificate of Conformance and/or Certificate of Analysis, as required, to verify product quality.
Reclaim Service Parameters
- Particles as low as @ 0.09µm (COPS excluded)
- Typical metal performance <2E10 atoms.cm2
- Precision dimensional and optical data
- Full CofA data, including type/res/thickness/particles and other requirements.
Oxidation Services
WRS Materials thermal oxidation furnaces are certified for growing wafers of 50.2 mm to 300 mm in diameter. We guarantee a 5 percent industry-standard uniformity across every batch, but typically our processed wafers qualify at a far better rate, enabling us to meet the tightest of customer specifications. With our dry thermal oxidation method, we grow oxides of 500 to 2000 angstroms, and our wet thermal oxidation process is applied for oxides of 2,000 to 100,000 angstroms.
Oxidation Service Parameters
- Available for wafers of 50.2mm-300mm in diameter
- Produces oxidation thicknesses of 500-100,000 angstroms
- Offers volume discounts
- Accommodates all quantities, with a minimum batch order of 25 wafers
Grinding Services
WRS Materials provides precision thinning services on wafers of 100mm to 300mm diameters, offering single-side or double-side grinding. Thinned to 50um, we apply our services to test and prime wafers purchased from WRS Materials as well as to customer-supplied wafers.
Polishing and Cleaning Services
We offer a polishing process to restore the surface of thinned wafers to a mirror finish. WRS Materials furnishes lapping, polishing and cleaning services for wafers of all sizes. We deliver wafers that are flatter and cleaner than conventional processes produce because we use high-quality slurry and a multi-step cleaning process. Our Class 10-100 cleanrooms and 100 percent inspection of final products ensure purity and quality.
Working with WRS Materials Services
A WRS Materials representative works closely with every customer, selecting the production facility that can best support each project’s specifications. In our three locations, we can strategically house material designated for specific customers, allowing for expedited production and shipping, while maintaining inventories through our Wafer Management System.
