Polish / Clean / Grind
Polishing and Cleaning Services
We offer a polishing process to restore the surface of thinned wafers to a mirror finish. WRS Materials furnishes lapping, polishing and cleaning services for wafers of all sizes. We deliver wafers that are flatter and cleaner than conventional processes produce because we use high-quality slurry and a multi-step cleaning process. Our Class 10-100 cleanrooms and 100 percent inspection of final products ensure purity and quality.
WRS Materials provides precision thinning services on wafers of 100mm to 300mm diameters, offering single-side or double-side grinding. Thinned to 50um, we apply our services to test and prime wafers purchased from WRS Materials as well as to customer-supplied wafers.